Forestville - We are the Sales Representative in Phili[ppines of Nihon Superior - Singapore. Nihon Superior provides high performance, high quality, and eco-friendly products. For Soldering: Environmental Protection: Lead-free solder alloys, Lead-free solder paste, Flux cored lead-free solder wire, VOC-free fluxes, No-clean soldering machines. Solder: Various kinds of alloy composition including Low/High melting point solder, Thermal fatigue resistant solder. Solder Paste, Flux cored solder wire, BGA sphere. Flux/Chemical: Fluxes for PCB soldering & tinning for electronics components and PCB. General fluxes for soldering various kinds of alloy including aluminum, stainless steel, nickel. ________________________________________________________________________________________ Lead-Free Solder SN100C (Sn-Cu-Ni+Ge) SN100C is being used in thousands of wave soldering machines around the world and has proved its reliability in products exposed to the most severe service environments.•The trace addition of Ni means fewer shorts and no shrinkage defects. •Ni-stabilized intermetalliclayer inhibits copper erosion. •Reliable in harsh environments. •High ductility ensure long service life of joints subjected to cyclic strain. •Formulated for minimal generation of dross. SN100CL for Hot Air Solder Leveling (HASL)(Sn-Cu-Ni+Ge) •Excellent fluidity •Bridge-free coating of the fine pitch circuitry •Bright smooth and uniform coating •Low copper erosion •Formation of stable intermetallic layer SN100C3 & SN100C4 High Temperature Dipper and Tinning Solder High temperature dip soldering and tinning of copper wire, polyurethane coated wire and component terminations. For use at up to 400°C. •SN100C3 and SN100C4 make it possible to carry out dip soldering and tinning operations with minimum copper erosion. High Reliability Lead-Free Solder Preforms SN100C（Sn-Cu-Ni+Ge） Suitable for micro-soldering •The finely dispersed microstructure of SN100C provides forming stability, even with very thin foil. ________________________________________________________________________________________ General Purpose SN100C P500 D4(Sn-Cu-Ni+Ge) Peak Reflow Temperature 240±5 deg CelciusBetter Solder Spread on 0.4mm pitch QFP Pads SN100C P500 D4 is a general purpose solder　paste suitable for fine pitch applications. In most cases SN100C can be reflowed with a profile similar to that used with SAC alloys•Excellent reflow with minimum incidence of solder balling and mid-chip balling •Excellent wetting on all common substrates including nickel and brass •Minimal cracking of flux residue •Maintains printability •Reflow with typical SnAgCuprofile (peak temperature of ~240°C) •No shrinkage cavities and stable IMC layer •Compliant alloy for reliability and impact strength •Cost effective silver-free formulation For 01005(0402 metric) Chip Components SN100C P520 D5 (Sn-Cu-Ni+Ge) Reflowed with peak 240℃±5℃ Pad dia.: 0.15mm Excellent Reflow Characteristics on Very Small Pads 　High reliability lead-free solder paste optimized to deliver good reflow with chip components down to 0402 metric. SN100C P520 D5 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine pitch mounting in which a reduction in joint strength is a concern due to the very small joint size.•Excellent Reflow Characteristics on Very Small Pads •Excellent Wetting Behavior (even on Brass and Nickel) •Minimal Cracking of Flux Residue •Good Hot Slump Performance。 •Stable Printability on Very Small Pads •Can Usually be Reflowed with a Profile Similar to that•Commonly Used with SAC305 and SAC405 with 240 ℃Peak •Compliant Alloy (SN100C) Provides High Reliability and•Impact Strength •Substantial Cost Advantage Halogen-Free SN100C P602 D4(Sn-Cu-Ni+Ge) new ! Peak Reflow Temperature 240 ±5 Degrees Celcius SOT23-3 PinExcellent Reflow to the Cut Edge of the Termination Highly Activated Halogen-Free Solder Paste SN100C (Sn-0.7Cu-0.05Ni+Ge) lead-free solder paste which does not contain halogens (F, Cl, Br, and I). No whisker observed as a result of the test that 1000 hour exposure under 85C/85% conditions. •Excellent reflow to the cut edge of the termination •Excellent wetting behavior •Minimum incidence of mid-chip balling •Stable Printability •Can usually be reflowed with a profile similar to that is commonly used with SAC305 and SAC405 with 240℃ peak. •SN100C alloy does not suffer shrinkage defects and has slow IMC growth and is ductile with excellent impact resistance. •Substantial cost advantage For Power Semiconductor SN100C P800 D2 (Sn-Cu-Ni+Ge) SN100C (SnCuNi+Ge) P800 D2 is a high reliability paste for device assembly that reduces voiding and reflow time.•Reduced voiding •Shortened reflow cycle times •Increased wettability•Excellent high speed printability even for large apertures •Prevention of shrinkage cavities and IMC growth •No shrinkage defects •Slow IMC growth •SN100C is a compliant alloy •SN100C has high impact strength Cost effective SN96CI PF-33 FMQ(Sn-Ag-Cu) Peak Reflow Temperature 230~235 Degrees CelciusSn-Ag-Cu eutectic lead-free solder for reflow soldering•Stable Cu6Sn5 intermetalliccompound •Formation of large plates of Ag3Sn suppressed in favor of uniform dispersion of fine crystals •Bright smooth fillets •Low incidence of shrinkage defects •Stable viscosity in continuous printing SN97C PF-31N FMQ(Sn-Ag-Cu) Stable viscosity in continuous printing Peak Reflow Temperature 230~235 Degrees celcius ________________________________________________________________________________________ Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch applications. •High ductility ensures high impact strength •Stable intermetalliccompound •Slow growth of interfacial intermetallic SN96CI/SN97C (Sn-Ag-Cu) "For DIA 0.1mm-0.9mm, use the compatible flux RM-5 for the optimum soldering" ________________________________________________________________________________________ Low Carbonizing SN100C(030) Time of start of carbonizing(sec.)Conditions】380℃ The flux-cored solder wire enables fast soldering with less carbonizing of soldering tip and less flux spatter providing greater productivity than existing products.Less ｔipand ｐadｃarbonizing•Less flux spatter •Less cracking of flux residue •Fast soldering •Fast melting •Good spread •Fewer shrinkage defect, Reduced copper erosion, and Stable intermetaliclayer (SN100C) •Substantial cost advantage Ultrafine Diameter new ! Halogen-Free SN100C(040) (Sn-Cu-Ni+Ge) Solder Appearance Directly After Tip Separation High Reliability Lead-free SN100C(Sn-0.7Cu-0.05Ni+Ge) solder with a core flux with a formulation that does not include F,Cl,Br,and I.•Good separation of the solder from the tip with consequent reduced incidence of icicles.•No whisker observed as a result of the test that 1000 hour exposure under 85C/85% conditions.•Good separation of the solder from the tip with reduced incidence of icicles •Reduced cracking of flux residue •Fewer shrinkage defects, reduced copper erosion, stable intermetalliclayer •Substantial cost advantage Low Spatter SN100C(510) (Sn-Cu-Ni+Ge) Spattering TestSpattering Rating 280℃ ～480℃ This high reliability flux-cored solder wire generates very little spatter even with the high solder tip temperatures required to burnoff.•Low flux spattering •Minimal cracking of flux residue •Can be used with soldering tip temperature of up to 480℃ •Low erosion of tip •SN100C Alloy means reduced risk of copper erosion during soldering and slow growth of interfacial intermetallic layer in service •Cost effective high temperature soldering ________________________________________________________________________________________ Rosin Based Flux for Lead-Free Wave Soldering NS-F850 NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering. •Excellent wetting •Excellent through-hole fill •Facilitates solder drainage to ensure minimum bridges and icicles •Prevents solder balls adhering to solder mask •Matte finish facilitates inspection after soldering •Ensures that the full reliability potential of SN100C lead-free solder is realized Halogen-Free Flux for Soldering NS-F900 new ! NS-F900 is a robust halogen-free flux that ensures excellent wetting even on oxidized copper. It is completely halogen-free, containing no halogens (F, Cl, Br, I), highly reliable post flux that provides excellent wetting up the leads and drainage and is the ideal flux for halogen-free lead-free wave soldering.•Excellent wetting. (even on oxidized copper) •Excellent wetting up the leads. •Reduced likelihood of dewettingafter two reflow cycles. •Facilitesdrainage to minimize incidence of icicles and bridges. •Ensures that the full reliability potential of SN100C lead-free solder is realized.

FRESTVILLE TECHNOLOGIES

A Worldwide Marketing Representative Group

We are the Sales Representative in Phili[ppines of Nihon Superior - Singapore.

Nihon Superior provides high performance, high quality, and eco-friendly products.

For Soldering:

Environmental Protection: Lead-free solder alloys, Lead-free solder paste, Flux cored lead-free solder wire, VOC-free fluxes, No-clean soldering machines.

Solder: Various kinds of alloy composition including Low/High melting point solder, Thermal fatigue resistant solder. Solder Paste, Flux cored solder wire, BGA sphere.

Flux/Chemical: Fluxes for PCB soldering & tinning for electronics components and PCB. General fluxes for soldering various kinds of alloy including aluminum, stainless steel, nickel.

________________________________________________________________________________________

Lead-Free Solder SN100C (Sn-Cu-Ni+Ge)

SN100C is being used in thousands of wave soldering machines around the world and has proved its reliability in products exposed to the most severe service environments.

•The trace addition of Ni means fewer shorts and no shrinkage defects.

•Ni-stabilized intermetalliclayer inhibits copper erosion.

•Reliable in harsh environments.

•High ductility ensure long service life of joints subjected to cyclic strain.

•Formulated for minimal generation of dross.

SN100CL for Hot Air Solder Leveling (HASL)(Sn-Cu-Ni+Ge)

•Excellent fluidity

•Bridge-free coating of the fine pitch circuitry

•Bright smooth and uniform coating

•Low copper erosion

•Formation of stable intermetallic layer

SN100C3 & SN100C4 High Temperature Dipper and Tinning Solder

High temperature dip soldering and tinning of copper wire, polyurethane coated wire and component terminations. For use at up to 400°C.

•SN100C3 and SN100C4 make it possible to carry out dip soldering and tinning operations

with minimum copper erosion.

High Reliability Lead-Free Solder Preforms SN100C（Sn-Cu-Ni+Ge）

Suitable for micro-soldering

•The finely dispersed microstructure of SN100C provides forming stability, even with very

thin foil.

________________________________________________________________________________________

General Purpose SN100C P500 D4(Sn-Cu-Ni+Ge)

Peak Reflow Temperature 240±5 deg Celcius

Better Solder Spread on 0.4mm pitch QFP Pads

SN100C P500 D4 is a general purpose solder　paste suitable for fine pitch applications. In most cases SN100C can be reflowed with a profile similar to that used with SAC alloys

•Excellent reflow with minimum incidence of solder balling and mid-chip

balling

•Excellent wetting on all common substrates including nickel and brass

•Minimal cracking of flux residue

•Maintains printability

•Reflow with typical SnAgCuprofile (peak temperature of ~240°C)

•No shrinkage cavities and stable IMC layer

•Compliant alloy for reliability and impact strength

•Cost effective silver-free formulation

For 01005(0402 metric) Chip Components SN100C P520 D5 (Sn-Cu-Ni+Ge)

Reflowed with peak 240℃±5℃

Pad dia.: 0.15mm

Excellent Reflow Characteristics on Very Small Pads

High reliability lead-free solder paste optimized to deliver good reflow with chip components down to 0402 metric. SN100C P520 D5 improves the joint quality of densely populated boards with filletless, small solder volume chip components and fine pitch mounting in which a reduction in joint strength is a concern due to the very small joint size.

•Excellent Reflow Characteristics on Very Small Pads

•Excellent Wetting Behavior (even on Brass and Nickel)

•Minimal Cracking of Flux Residue

•Good Hot Slump Performance。

•Stable Printability on Very Small Pads

•Can Usually be Reflowed with a Profile Similar to that

•Commonly Used with SAC305 and SAC405 with 240 ℃Peak

•Compliant Alloy (SN100C) Provides High Reliability and

•Impact Strength

•Substantial Cost Advantage

Halogen-Free SN100C P602 D4(Sn-Cu-Ni+Ge) new !

Peak Reflow Temperature 240 ±5 Degrees Celcius

SOT23-3 Pin
Excellent Reflow to the Cut Edge of the Termination

Highly Activated Halogen-Free Solder Paste SN100C (Sn-0.7Cu-0.05Ni+Ge) lead-free solder paste which does not contain halogens (F, Cl, Br, and I). No whisker observed as a result of the test that 1000 hour exposure under 85C/85% conditions.

•Excellent reflow to the cut edge of the termination

•Excellent wetting behavior

•Minimum incidence of mid-chip balling

•Stable Printability

•Can usually be reflowed with a profile similar to that is commonly used with SAC305 and SAC405 with

240℃ peak.

•SN100C alloy does not suffer shrinkage defects and has slow IMC growth and is ductile with excellent

impact resistance.

•Substantial cost advantage

For Power Semiconductor SN100C P800 D2 (Sn-Cu-Ni+Ge)

SN100C (SnCuNi+Ge) P800 D2 is a high reliability paste for device assembly that reduces voiding and reflow time.

•Reduced voiding

•Shortened reflow cycle times

•Increased wettability

•Excellent high speed printability even for large apertures

•Prevention of shrinkage cavities and IMC growth

•No shrinkage defects

•Slow IMC growth

•SN100C is a compliant alloy

•SN100C has high impact strength Cost effective

SN96CI PF-33 FMQ(Sn-Ag-Cu)

Peak Reflow Temperature 230~235 Degrees Celcius

Sn-Ag-Cu eutectic lead-free solder for reflow soldering

•Stable Cu6Sn5 intermetalliccompound

•Formation of large plates of Ag3Sn suppressed in favor of uniform dispersion of fine crystals

•Bright smooth fillets

•Low incidence of shrinkage defects

•Stable viscosity in continuous printing

SN97C PF-31N FMQ(Sn-Ag-Cu)

Stable viscosity in continuous printing

Peak Reflow Temperature 230~235 Degrees celcius

________________________________________________________________________________________

Impact Strength SN100C (Sn-Cu-Ni+Ge)

Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch applications.

•High ductility ensures high impact strength

•Stable intermetalliccompound

•Slow growth of interfacial intermetallic

SN96CI/SN97C (Sn-Ag-Cu)

"For DIA 0.1mm-0.9mm, use the compatible flux RM-5 for the optimum soldering"

________________________________________________________________________________________

Low Carbonizing SN100C(030)

Time of start of carbonizing(sec.)
Conditions】380℃

The flux-cored solder wire enables fast soldering with less carbonizing of soldering tip and less flux spatter providing greater productivity than existing products.

Less ｔipand ｐadｃarbonizing

•Less flux spatter

•Less cracking of flux residue

•Fast soldering

•Fast melting

•Good spread

•Fewer shrinkage defect, Reduced copper erosion, and Stable intermetaliclayer (SN100C)

•Substantial cost advantage

Ultrafine Diameter new !

Halogen-Free SN100C(040) (Sn-Cu-Ni+Ge)

Solder Appearance Directly After Tip Separation

High Reliability Lead-free SN100C(Sn-0.7Cu-0.05Ni+Ge) solder with a core flux with a formulation that does not include F,Cl,Br,and I.

•Good separation of the solder from the tip with consequent reduced incidence of icicles.

•No whisker observed as a result of the test that 1000 hour exposure under 85C/85% conditions.

•Good separation of the solder from the tip with reduced incidence of icicles

•Reduced cracking of flux residue

•Fewer shrinkage defects, reduced copper erosion, stable intermetalliclayer

•Substantial cost advantage

Low Spatter SN100C(510) (Sn-Cu-Ni+Ge)

Spattering Test
Spattering Rating 280℃ ～480℃

This high reliability flux-cored solder wire generates very little spatter even with the high solder tip temperatures required to burnoff.

•Low flux spattering

•Minimal cracking of flux residue

•Can be used with soldering tip temperature of up to 480℃

•Low erosion of tip

•SN100C Alloy means reduced risk of copper erosion during soldering and slow growth of

interfacial intermetallic layer in service

•Cost effective high temperature soldering

________________________________________________________________________________________

Rosin Based Flux for Lead-Free Wave Soldering NS-F850

NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges and icicles. It is the ideal flux for lead-free wave soldering.

•Excellent wetting

•Excellent through-hole fill

•Facilitates solder drainage to ensure minimum bridges and icicles

•Prevents solder balls adhering to solder mask

•Matte finish facilitates inspection after soldering

•Ensures that the full reliability potential of SN100C lead-free solder is realized

Halogen-Free Flux for Soldering NS-F900 new !

NS-F900 is a robust halogen-free flux that ensures excellent wetting even on oxidized copper.
It is completely halogen-free, containing no halogens (F, Cl, Br, I), highly reliable post flux that provides excellent wetting up the leads and drainage and is the ideal flux for halogen-free lead-free wave soldering.

•Excellent wetting. (even on oxidized copper)

•Excellent wetting up the leads.

•Reduced likelihood of dewettingafter two reflow cycles.

•Facilitesdrainage to minimize incidence of icicles and bridges.

•Ensures that the full reliability potential of SN100C lead-free solder is realized.