ALPS 2

ALPS 2 has provided solutions to the semiconductor industry for wafer mapping in inkless assembly since 1995. With its large installed base, comprehensive program features and support for a wide range of equipment models, ALPS 2 is the industry’s leading wafer map data management and equipment integration software product for inkless assembly.

ALPS 3 Overview

ALPS 3 is the latest generation which builds on the foundation provided by ALPS 2.

ALPS 3 offers a total solution for managing substrate maps used during the test, assembly and packaging of advanced semiconductors.

 ALPS 3 adds native support for the new SEMI E142 Substrate Mapping standard which offers a unified approach for...

more substrate types (wafer, frame, strip, tray,...)

more data types, (bin code, XY transfer, device identifier for single device tracking, ...)

more process steps and more equipment integrated (wafer probe, bump inspect, die attach, flip chip, wire bond, strip test, laser mark, singulate and fnal test)

It is now possible to track single devices through the entire process. Device quality (bin code) can be fed forward to prevent further processing time and consumable being expended on known bad devices. Test and inspection defects detected at any point in the process can be correlated with substrate geometry patterns, equipment, consumables, shift, etc. to identify and correct the root cause of defect.