We are the Sales Representative of Daitron - Japan.

Automatic Wafer Chip Sorting Machine

WCS- 700B/WCS-1200B (RING to TRAY)

The WCS-700B / WCS-1200B machines sort diced semiconductor devices (chips) to a tray as determined by the presence of a reject marker on the chip or according to data supplied on a floppy disk.
WCS-700B: 8-inch (MAX)
WCS-1200B (Ring to Tray): 12-inch (MAX)

Characteristics:

・High-speed basic sorters with emphasis on chip transfer speed and accuracy. For small (elongate) chip    sorting with high precision Manual loading of wafer rings and trays.
・Chips are sorted as determined by the presence of a reject marker on the chip or according to data supplied on a floppy disk.

Specifications:

Wafer size:                   WCS-700B: 8-inch (Max)

                                   WCS-1200B: 12-inch (Max)       

Tray size:                     Square 2-, 3-, and 4-inch, Jedec 

Image processor:           Multi-value processing

Chip theta correction:    Standard (+/- 5 Degrees correction)

Expand mechanism:      Standard

Chip peeling method:     Non-contact, synchronous

Map sorting:                 20 (square 2-inch tray)  

Chip Sorting Machine

WCS-822B

High speed automatic sorting machine with linear transfer pick arm
Sorting based on data in a floppy disk is available.

Characteristics:

・This machine sorts diced chips to a tray in accordance with presence of reject mark on a chip or data of a probing machine stored in a floppy disk.
・We offer a variety of sorting machines designed with our rich experiences.

Specifications:

Tact time:                     0.5 sec/chip (Min.) 

Wafer size:                   8-inch (6-inch), square1 40mm- square40 mm x 6

Tray size:                     Square 2-, 3-, and 4-inch

                                   (For JEDEC tray, Model:WCS-812J)        

Image processor:          Multi-value processing

Chip theta correction:    Standard feature (+/- 5 Degrees offset)

Ring rotation:                Standard feature (360 degrees rotation)

Expand mechanism:      Standard feature

Chip peeling method:     Non-contact synchronous type.

Tray change:                 At least 1 second

Ring change:                 At least 25 seconds

Automatic Wafer Chip Sorting Machine

WCS-833B (RING to TRAY)

 

WCS-833B: up to 8-inch(MAX)
WCS-1233B: up to 12-inch(MAX)
Simultaneous 3-tray sorting is available.

Characteristics:

・WCS-833B is a fully automated chip sorting machine with our latest vertical semi-circular transfer mechanism.

Specifications:

Wafer size:                   WCS-833B: 8-inch (Max.)

                                   WCS-1233B: 12-inch (Max.)

Tray size:                     Square 2-, 3-, and 4-inch, JEDEC tray

Image processor:          Multi-value processing

Chip theta correction:    Standard feature (+/- 5 Degrees offset)

Ring rotation:                Standard feature (360 degrees rotation)

Expand mechanism:      Standard feature

Chip Sorting Machine [Ring to Ring]

WCS-1217B

The WCS-1217B automatically mounts chips to a wafer tape ring by a linear transfer double pickup arm. The machine sorts a chip in accordance with data supplied on a floppy disk or through communication with a host PC. (UPH6000) 

Characteristics:

・The WCS-1217B sorts diced semiconductor devices (chips) to a tray as determined by the presence of a reject marker on the chip or according to data supplied on a floppy disk.
・We offer a variety of sorting machines designed with our rich experiences.