We are the Business Associate in Philippines of Astronics - Singapore.

Chemical Plasma Cleaner

Wafer Level Plasma Cleaner

Features:

• Wafer size : 8” to 12”.

• Throughput 25 wafers / hr

• Wafer handling : Fully automatic.

• WLCSP, MEMS, sensor device packaging and etc

• Patented Hydrogen process gas.

• Radio frequency.

• Plasma Chemical Cleaning (PCC mode)

• Premixed gas Ar/H2 (optional Ar/O2, & AR/N2)

• Wafer handling in N2 atmosphere.

Plasma Cleaning Systems

Features

• Type:   DC Plasma.

• Configuration:   Batch, Strip & In-line systems

• Chemical and physical cleaning available

• Patented hydrogen/Nitrogen gas process

• Staging Time ~ up to 7 days

• Process self terminates upon completion

General Specifications

• 8 std magazines/ cycle
• Standalone strip loading : 1 to 10 strips

      (Application dependent)

3. Wafer loading: 24 pcs/cycle

4.   Gas types: Argon, Hydrogen, Nitrogen, 

      Oxygen, Premixed gases

Multi-Strip Cleaners

General Specifications:

1.Substrates type:  Lead frames, BGA, CSP and etc.

2.Chemical cleaning (RF).

3.Automatic Strip handling.
- Strip loading : 5 (i.e. 63mm strip width)

4.Gas types: Argon, Hydrogen, Nitrogen, Oxygen,

       or Ar/H2, Ar/O2, Ar/N2.

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Contact Angle Analyzer

Contact Angle Analyzer (with/ without computer)

Features:

1.Instrument Type :  Automatic, semi-auto

2.Methods available: 

• Static
• Dynamic (Advance/ Recede continuous measurement
• Surface tension

3.    High Speed CCD Camera

Continuous image capture and Surface topography software

General Specification

1. Algorithms: 

• Dispersive using Owens-Wendt and Van Oss Equation
• Wetting from Owens-Wendt Surface Energy
• Critical surface Engery by Zisman Equation
• Lewis Acid/ Base

• 8”/ 12” wafer stage
• Long PCB/ Substrate stage

Features:

1. Robotic handling capability for 300mm wafer

2. Programmable droplet size

3. Automatic placement of the droplet on the wafer, movement for droplet placement is programmable.

4.    System capable for measurements with second liquid.

5.    After measurement liquid will be evaporated by hotplate.

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